### 22,000

The approximate number of living ECE ILLINOIS alumni worldwide.

Title | Rubric | Section | CRN | Type | Hours | Times | Days | Location | Instructor |
---|---|---|---|---|---|---|---|---|---|

Intro to VLSI System Design | ECE425 | AB1 | 48121 | LAB | 0 | - | Deming Chen | ||

Intro to VLSI System Design | ECE425 | AL1 | 36897 | LEC | 3 | 1530 - 1650 | T R | 3081 ECE Building | Deming Chen |

Complementary Metal-Oxide Semiconductor (CMOS) technology and theory; CMOS circuit and logic design; layout rules and techniques; circuit characterization and performance estimation; CMOS subsystem design; Very-Large-Scale Integrated (VLSI) systems design methods; VLSI Computer Aided Design (CAD) tools; workstation-based custom VLSI chip design using concepts of cell hierarchy; final project involving specification, design, and evaluation of a VLSI chip or VLSI CAD program; written report and oral presentation on the final project. Course Information: 3 undergraduate hours. 3 graduate hours. Prerequisite: ECE 385 and ECE 411; or CS 233.

Computer Engineering

CMOS technology and theory; CMOS circuit and logic design; layout rules and techniques; circuit characterization and performance estimation; CMOS subsystem design; VLSI systems design methods; VLSI CAD tools; laboratory experience in custom VLSI chip design.

Same as CS 435.

The aim of this course is to provide an introduction to the design and layout of Very Large Scale Integrated (VLSI) circuits for complex digital systems. It covers custom design, cell-based hierarchical design, and algorithmic aspects of VLSI CAD tools. With a focus on CMOS technology, students generate layouts of CMOS chips on engineering workstations in an associated laboratory. By the end of the course, students will have designed, laid out, and verified a 4-bit microprocessor modeled after the Am2901 from Advanced Micro Devices.

- CMOS technology and theory of operation
- CMOS circuit and logic design
- CMOS layout rules and techniques
- CMOS circuit characterization and performance estimation
- CMOS subsystem design
- VLSI systems design methods
- VLSI computer-aided design tools

The aim of this course is to provide an introduction to the design and layout of Very Large Scale Integrated (VLSI) circuits for complex digital systems. It covers custom design, cell-based hierarchical design, and algorithmic aspects of VLSI CAD tools. With a focus on CMOS technology, students generate layouts of CMOS chips on engineering workstations in an associated laboratory. By the end of the course, students will have designed, laid out, and verified a 4-bit microprocessor modeled after the Am2901 from Advanced Micro Devices.

Topics:

- CMOS technology and theory of operation
- CMOS circuit and logic design
- CMOS layout rules and techniques
- CMOS circuit characterization and performance estimation
- CMOS subsystem design
- VLSI systems design methods
- VLSI computer-aided design tools

Same as CS 435.

The four machine problems based on designing CMOS VLSI subsystems and chips on color graphic workstations using Mentor Grpahics IC design tools on HP and SUN workstations.

- Design and layout of a simple CMOS cell, e.g., adder.
- Design, layout and simulation of a CMOS subsystem, e.g., ALU.
- Design, layout and simulation of a CMOS microprocessor chip, with pads.
- Design, layout and simulation of CMOS functional unit, e.g., a multiplier, using automatic layout techniques.

- Basic logic design of computing circuits, or
- Basic computer architecture

N. Weste and K. Eshraghian, *Principles of CMOS VLSI Design*, 2nd ed., Addison Wesley, 1993.

Class notes.

Engineering Science: 1 credit

Engineering Design: 2 credits

This course provides an introduction to the design, layout, and testing of VLSI circuits for complex digital systems. The goals are to enable students to design circuits using custom and cell-based approaches, generate layouts, verify the designs, apply tests to manufactured chips, and understand the algorithmic aspects of VLSI CAD tools.

**A. By the time of Exam No. 1 (after 14 lectures), students should be able to do the following:**

1. Show the basic steps of CMOS IC fabrication process. (a)

2. Given the N-network for a complex static CMOS logic gate, derive the P-network (or vice versa) and the Boolean function. (e)

3. Given the Boolean function for a complex static CMOS logic gate, derive the N and P networks. (e)

4. Given the transistor-level diagram for a complex CMOS logic gate, show an efficient Sticks Diagram to implement the gate. (e)

5. Given a layout and a set of capacitance parameters, compute node capacitances. (e)

6. Given a layout and set of resistance parameters, compute interconnect resistances. (e)

7. Given a transistor-level diagram with specified input, capacitance and resistance values, show an equivalent RC network. For a given input transition, compute the time at which the output makes a corresponding transition. (e)

8. Show the DC transfer characteristics for a static CMOS inverter. (a)

9. Show the different conditions for a transistor to be in cutoff, linear and saturation modes. (a)

10. Show the first order formulas for computing the Current I_{ds}, which flows through the transistor channel in linear and saturation modes. (a, m)

11. Show a logic-level diagram for a VLSI subsystem, such as an adder, ALU, shifter, counter, or multiplier. (c)

12. Show the organization of a RAM, provide transistor-level diagrams of static and dynamic RAM cells, and give logic-level or transistor-level schematics for row and column decoders. (c)

13. Illustrate the organization and timing of a PLA. (a, c)

14. Compute the relative sizes of nMOS and pMOS transistors needed to equalize worst case rise and fall times. (e)

15. Show the state diagram, state table, and required PLA programming for a simple finite state machine. (e)

16. Compute gate sizes on a path to optimize the path delay using logic effort. (e)

**B. By the time of Exam No. 2 (after 26 lectures), students should be able to do the following:**

17. Analyze the power consumption of a simple gate-level circuit, and itemize various ways to reduce power dissipation. (a, e)

18. Given a gate-level circuit diagram, generate a test vector to test for a stuck-at fault.

(e)

19. Show how test vectors are applied to a full scan design. (e)

20. Explain how self-testing is done in a BIST environment. (a)

21. Compare and contrast various design methodologies, such as custom design and cell based design. (a)

22. Use a Hardware Description Language, such as Verilog, for circuit design. (a, c, k)

23. Illustrate the operation of a logic optimization procedure for a simple Boolean function. (a, e)

24. Use BDD to represent and optimize logic function. (a, e)

25. Perform partitioning using a constructive partitioning algorithm, such as the Fiduccia-Mattheyses algorithm. (a, e)

26. Illustrate the operation of various shortest path algorithms. (a, e)

27. Illustrate the operation of various net routing algorithms, such as the left-edge and greedy algorithms for channel routing, the Hightower and Mikami-Tabuchi line probe algorithms, and the maze routing algorithm. (a)

28. Given a high-level circuit description, construct the corresponding sequencing graph, schedule all operations using various scheduling algorithms, and perform resource allocation and binding. (a, e)

29. Show the basic steps involved for chip packaging. (a)

**C. By the end of the course, students should be able to do the following:**

30. Describe the procedures used in static and dynamic timing analysis tools. (a)

31. Custom design various simple and complex logic gates, and interconnect cells to form a subsystem. (a, c, k)

32. Custom design the datapath for a 4-bit microcontroller (Am2901). (a, c, k)

33. Use automatic synthesis and automatic placement and routing tools to implement the control logic for a 4-bit microcontroller (Am2901). Interconnect the datapath and control logic. (c, k)

34. Specify test vectors, run the functional test, and analyze the results to adequately verify the functionality of the Am2901 design. (a, c, k)

35. Explain how trends in technology impact circuit characteristics, such as delay and power consumption. (j)

9/22/2014

The approximate number of living ECE ILLINOIS alumni worldwide.

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