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Contact Info

Audrey LeGrande
Assistant Director of Alumni
and Student Relations
1072 ECE Building
306 N. Wright Street
Urbana, IL 61801
Phone: (217) 300-1783


We've created this space to help you stay connected with ECE ILLINOIS. We're sure you'll find it to be a great resource for information, news, and networking.

If you don't see what you need here, or if we can be of assistance in any way, don't hesitate to call us! And, as always, don't be a stranger. Use our online Stay Connected form to let us know what you're up to! Coming to campus? Send us an email.

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Alumni Awards

Distinguished Alumni Award (2010)

For significant contribution to engineering education and technology leader in CAD system for multi-chip module products.

Philip Ching Ho Chan

Philip Ching Ho Chan

MSEE 75, PhD 78
Deputy President and Provost
The Hong Kong Polytechnic University
Hong Kong

Following the completion of his PhD, Philip C. H. Chan was a visiting assistant professor in ECE from 1978 to 1981. He then went to work for Intel Corporation, Santa Clara, California from 1981 to 1991. At Intel he worked on technology development, design technology (CAD), packaging technology development, multi-chip module technology, and product development.

He joined the Hong Kong University of Science and Technology in 1991 as a founding faculty member. He served as the Head of the Electrical and Electronic Engineering Department from 1995 to 2002, He served as the dean of engineering from 2003 to 2009. He was the director of the Nanoelectronics Fabrication Facility (NFF) from 1997 to 2003. NFF is the most comprehensive micro- and nanoelectronics fabrication facility in Hong Kong. In March, 2010, he became the deputy president and provost at the Hong Kong Polytechnic University, overseeing all academic and research enterprises in the University.

Philip serves on the board of several companies in Hong Kong and China. He consults extensively for government and industry. He holds 10 international patents. Philip and his students have published more than 300 papers in international journals and conferences. He is an IEEE Fellow.