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CSL Seminar featuring Jian Chen, Senior Vice President of 3D NAND Technology at SanDisk

Originating Calendar ECE ILLINOIS Seminars
Speaker Jian Chen, Senior Vice President at SanDisk
Date: 4/21/2017
Time: 12 p.m.
Location:

CSL Auditorium B02

Sponsor:

CSL

Event Type: Seminar/Symposium
 

Abstract: Over the past 20 years, NAND flash memory has grown to a $30 billion industry and penetrated every aspect of modern life. NAND technology has scaled from below 15nm in 2D and is now making a transition to 3D memory. This talk will briefly cover 2D NAND scaling and applications, and will then focus on where we are in the 3D NAND era: what the challenges and opportunities are in process technology, device architecture, and new materials for various parts of the structure, and the chemical, mechanical, and electrical effects and their interactions.

Bio: Dr. Jian Chen is Senior Vice President of 3D NAND Technology at SanDisk, a Western Digital brand.

In his current role, he is responsible for overall 3D NAND technology at SanDisk. Prior to 2013, he was VP of Memory System, where he led the exploration of novel storage system architectures and ecosystems and managed the memory systems architecture group, which was responsible for the design of USB, CFh, SD/uSD, and SSD products.

From 2005 to 2007, he worked at SanDisk’s joint fab with Toshiba in Yokkaichi, Japan, where he built and led the product and technology development teams from their inception. In 1999, he became SanDisk’s first device engineer to work on NAND, and served as manager and director of NAND flash memory device and reliability and led the development of the 0.16μm 1G, the world’s first MLC NAND flash.


Prior to joining SanDisk, Chen worked on NOR flash memory at AMD. Holder of over 130 granted U.S. patents, he is co-author of a book chapter on flash memory reliability and the JEDEC flash memory reliability standard. He received his M.S. and Ph.D. from UC Berkeley in EECS, and a B.S. in Solid State Device Physics from the University of Electronic Science and Technology, Chengdu, China.

To request disability-related accommodations for this event, please contact the person listed above, or the unit hosting the event.